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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate
Kim, Jaewon, Lee, Byunghoon, Lek, Jun Yan, Made, Riko I, Salam, Budiman, Gan, Chee LipYear:
2014
Language:
english
DOI:
10.1109/EPTC.2014.7028308
File:
PDF, 362 KB
english, 2014