Study on the properties of conductive adhesives in various curing manners for MCM applications
Gao, Hong, Hu, GuoJun, Zhou, JinWen, Zou, JiaJia, Qian, JiangRongVolume:
28
Language:
english
Journal:
Journal of Adhesion Science and Technology
DOI:
10.1080/01694243.2014.925388
Date:
September, 2014
File:
PDF, 830 KB
english, 2014