[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Fast time domain crosstalk analysis of through silicon vias based on equivalent circuit model
Zhang, Zhilong, Fang, Runiu, Wang, Guanjiang, Sun, Xin, Jin, Yufeng, Miao, MinYear:
2014
Language:
english
DOI:
10.1109/ICEPT.2014.6922621
File:
PDF, 457 KB
english, 2014