Application of ink screening models to solder paste...

Journal of Electronics Manufacturing 1993 / 09 Vol. 3; Iss. 3

Application of ink screening models to solder paste printing in SMT assembly

MANNAN, S. H., EKERE, N. N., LO, E. K., ISMAIL, I.
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Volume:
3
Language:
english
Journal:
Journal of Electronics Manufacturing
DOI:
10.1142/S0960313193000139
Date:
September, 1993
File:
PDF, 1.30 MB
english, 1993
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