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Reduction of Etch Pits of Electropolished Cu by Additives
Shieh, Jia-Min, Chang, Shih-Chieh, Wang, Ying-Lang, Dai, Bau-Tong, Cheng, Shih-Song, Ting, JackVolume:
151
Year:
2004
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1757461
File:
PDF, 793 KB
english, 2004