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[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Reliability investigations of large die wafer level packages: Optimization of package structure and materials to improve board level reliability
Jarn, Markus, Hsieh, Chueh-An, Pai, Yu-Chi, Wang, Tsaiying, Hunt, JohnYear:
2014
Language:
english
DOI:
10.1109/estc.2014.6962809
File:
PDF, 1.72 MB
english, 2014