Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
2009 Vol. 27; Iss. 5
Etch stop in via-hole etching on aluminum interconnection using inductively coupled C[sub 2]F[sub 6] plasma with O[sub 2] additive gas
Imai, Shin-ichi, Jiwari, NobuhiroVolume:
27
Year:
2009
Language:
english
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
DOI:
10.1116/1.3225593
File:
PDF, 917 KB
english, 2009