[IEEE 2014 Electronics System-Integration Technology Conference (ESTC) - Helsinki, Finland (2014.9.16-2014.9.18)] Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) - Copper thick-film substrates for power electronic applications
Blank, T., Leyrer, B., Maurer, T., Meisser, M., Bruns, M., Weber, M.Year:
2014
Language:
english
DOI:
10.1109/estc.2014.6962860
File:
PDF, 1.23 MB
english, 2014