[ECS 209th ECS Meeting - Denver, Colorado (May 7-May 12, 2006)] ECS Transactions - Simultaneous Filling of Microvia and Through Hole by Copper Electroplating for High Density Interconnection of PCB
Dow, Wei-Ping, Chen, Hsiang-Hao, Yen, Ming-Yao, Liu, Cheng-WeiVolume:
2
Year:
2007
Language:
english
DOI:
10.1149/1.2408880
File:
PDF, 648 KB
english, 2007