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Effects of Additives on Copper Electrodeposition in Submicrometer Trenches
Hasegawa, Madoka, Negishi, Yoshinori, Nakanishi, Takuya, Osaka, TetsuyaVolume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1867672
File:
PDF, 490 KB
english, 2005