Wafer-level Au–Au bonding in the 350–450 °C temperature...

Journal of Micromechanics and Microengineering 2014 / 08 Vol. 24; Iss. 8

Wafer-level Au–Au bonding in the 350–450 °C temperature range

Tofteberg, Hannah R, Schjølberg-Henriksen, Kari, Fasting, Eivind J, Moen, Alexander S, Taklo, Maaike M V, Poppe, Erik U, Simensen, Christian J
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Volume:
24
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/24/8/084002
Date:
August, 2014
File:
PDF, 850 KB
english, 2014
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