Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical...

Journal of Alloys and Compounds 2015 / 05 Vol. 632

Sn–0.7wt%Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient

Silva, Bismarck Luiz, Cheung, Noé, Garcia, Amauri, Spinelli, José Eduardo
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
632
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2015.01.140
Date:
May, 2015
File:
PDF, 4.95 MB
english, 2015
Conversion to is in progress
Conversion to is failed