Simple Modeling and Characterization of Stress Migration...

Simple Modeling and Characterization of Stress Migration Phenomena in Cu Interconnects

Tsuchikawa, Haruo, Mizushima, Yoriko, Nakamura, Tomoji, Suzuki, Takashi, Nakajima, Hirochika
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Volume:
45
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/jjap.45.714
Date:
February, 2006
File:
PDF, 267 KB
english, 2006
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