![](/img/cover-not-exists.png)
Simple Modeling and Characterization of Stress Migration Phenomena in Cu Interconnects
Tsuchikawa, Haruo, Mizushima, Yoriko, Nakamura, Tomoji, Suzuki, Takashi, Nakajima, HirochikaVolume:
45
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.1143/jjap.45.714
Date:
February, 2006
File:
PDF, 267 KB
english, 2006