Effect of novel alkaline copper slurry on 300 mm copper global planarization
Liu, Weijuan, Liu, Yuling, Wang, Chenwei, Chen, Guodong, Jiang, Mengting, Yuan, Haobo, Cheng, PengfeiVolume:
35
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/35/9/096003
Date:
September, 2014
File:
PDF, 1.44 MB
english, 2014