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Evaluation of planarization performance for a novel alkaline copper slurry under a low abrasive concentration
Jiang, Mengting, Liu, Yuling, Yuan, Haobo, Chen, Guodong, Liu, WeijuanVolume:
35
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/35/11/116002
Date:
November, 2014
File:
PDF, 1.93 MB
english, 2014