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Copper electrodeposition in a through-silicon via evaluated by rotating disc electrode techniques
Tsai, Tzu-Hsuan, Huang, Jui-HsiungVolume:
20
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/20/11/115023
Date:
November, 2010
File:
PDF, 1.29 MB
english, 2010