Damage and stress evolution in the bondlines of metallic...

Damage and stress evolution in the bondlines of metallic adhesively bonded joints accompanied by bondline thickness effect

Xu, Wei, Yu, Huichen, Tao, Chunhu
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Volume:
59
Language:
english
Journal:
International Journal of Adhesion and Adhesives
DOI:
10.1016/j.ijadhadh.2015.02.007
Date:
June, 2015
File:
PDF, 793 KB
english, 2015
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