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Characterization of the Young’s modulus, residual stress and fracture strength of Cu–Sn–In thin films using combinatorial deposition and micro-cantilevers
Sasangka, Wardhana A, Gan, Chee Lip, Lai, Donny, Tan, Chuan Seng, Thompson, Carl VVolume:
25
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/25/3/035023
Date:
March, 2015
File:
PDF, 2.32 MB
english, 2015