Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density
Caccuri, V., Milhet, X., Gadaud, P., Bertheau, D., Gerland, M.Volume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-014-3458-x
Date:
December, 2014
File:
PDF, 5.69 MB
english, 2014