Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys
Reeve, Kathlene N., Anderson, Iver E., Handwerker, Carol A.Volume:
44
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-014-3551-1
Date:
March, 2015
File:
PDF, 7.94 MB
english, 2015