Failure study of solder joints subjected to random vibration loading at different temperatures
Zhang, Hongwu, Liu, Yang, Wang, Jian, Sun, FenglianVolume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-2693-0
Date:
April, 2015
File:
PDF, 1.04 MB
english, 2015