Effect of BaTiO3 on the microstructure and mechanical properties of Sn1.0Ag0.5Cu lead-free solder
Yang, Li, Ge, Jinguo, Zhang, Yaocheng, Dai, Jun, Jing, YanfengVolume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-014-2443-8
Date:
January, 2015
File:
PDF, 2.01 MB
english, 2015