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Investigation on the effect of Sn grain number and orientation on the low cycle fatigue deformation behavior of SnAgCu/Cu solder joints
Gao, Ruiting, Li, Xiaoyan, Zhu, YongxinVolume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-2664-5
Date:
April, 2015
File:
PDF, 1.24 MB
english, 2015