Study on stress evolution in the cooling process of micro...

International Journal of Mechanical and Materials Engineering 2014 / 12 Vol. 9; Iss. 1

Study on stress evolution in the cooling process of micro hot embossing

Gomez, Juan A, Lek, Devanda, Song, In-Hyouk, You, Byoung Hee
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Volume:
9
Language:
english
Journal:
International Journal of Mechanical and Materials Engineering
DOI:
10.1186/s40712-014-0020-9
Date:
December, 2014
File:
PDF, 3.12 MB
english, 2014
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