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Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions
Lee, Sang-Min, Yoon, Jeong-Won, Jung, Seung-BooVolume:
26
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-014-2589-4
Date:
March, 2015
File:
PDF, 4.55 MB
english, 2015