A new wafer level TSV build-up stacking using oxide bonding

Journal of Micromechanics and Microengineering 2013 / 06 Vol. 23; Iss. 6

A new wafer level TSV build-up stacking using oxide bonding

Kim, Sun-Rak, Song, Jun-Yeob, Lee, Seung S, Lee, Jae Hak
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Volume:
23
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/23/6/065015
Date:
June, 2013
File:
PDF, 3.78 MB
english, 2013
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