Comparison of the copper and gold wire bonding processes...

Journal of Semiconductors 2011 / 02 Vol. 32; Iss. 2

Comparison of the copper and gold wire bonding processes for LED packaging

Chen, Zhaohui, Liu, Yong, Liu, Sheng
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Volume:
32
Language:
english
Journal:
Journal of Semiconductors
DOI:
10.1088/1674-4926/32/2/024011
Date:
February, 2011
File:
PDF, 711 KB
english, 2011
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