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Effect of Cu–Sn intermetallic compound reactions on the Kirkendall void growth characteristics in Cu/Sn/Cu microbumps
Park, Jong-Myeong, Kim, Seung-Hyun, Jeong, Myeong-Hyeok, Park, Young-BaeVolume:
53
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.53.05HA06
Date:
May, 2014
File:
PDF, 65 KB
english, 2014