Analysis of fatigue delamination growth in flip-chip...

Analysis of fatigue delamination growth in flip-chip package

Lai, Y.-S., Chen, C.-H., Chiu, T.-C.
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Volume:
225
Language:
english
Journal:
Acta Mechanica
DOI:
10.1007/s00707-014-1201-6
Date:
October, 2014
File:
PDF, 936 KB
english, 2014
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