Analysis of fatigue delamination growth in flip-chip package
Lai, Y.-S., Chen, C.-H., Chiu, T.-C.Volume:
225
Language:
english
Journal:
Acta Mechanica
DOI:
10.1007/s00707-014-1201-6
Date:
October, 2014
File:
PDF, 936 KB
english, 2014