Slip, Crystal Orientation, and Damage Evolution During...

Journal of Electronic Materials 2015 / 3 Vol. 44; Iss. 3

Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages

Zhou, Bite, Zhou, Quan, Bieler, Thomas R., Lee, Tae-kyu
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Volume:
44
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-014-3572-9
Date:
March, 2015
File:
PDF, 12.31 MB
english, 2015
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