Reliability of SnAgCu/SnAgCuCe solder joints with different...

Journal of Materials Science: Materials in Electronics 2014 / 10 Vol. 25; Iss. 10

Reliability of SnAgCu/SnAgCuCe solder joints with different heights for electronic packaging

Zhang, Liang, Han, Ji-guang, Guo, Yong-huan, Sun, Lei
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Volume:
25
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-014-2192-8
Date:
October, 2014
File:
PDF, 1.32 MB
english, 2014
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