Evaluation of the bond quality of laser-joined sapphire...

Microsystem Technologies 2016 / 1 Vol. 22; Iss. 1

Evaluation of the bond quality of laser-joined sapphire wafers using a fresnoite-glass sealant

de Pablos-Martín, A., Tismer, S., Naumann, F., Krause, M., Lorenz, M., Grundmann, M., Höche, Th.
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Volume:
22
Language:
english
Journal:
Microsystem Technologies
DOI:
10.1007/s00542-015-2459-x
Date:
January, 2016
File:
PDF, 1.04 MB
english, 2016
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