Advanced Cu chemical displacement technique for SiO2-based...

Nanoscale Research Letters 2014 Vol. 9; Iss. 1

Advanced Cu chemical displacement technique for SiO2-based electrochemical metallization ReRAM application

Chin, Fun-Tat, Lin, Yu-Hsien, You, Hsin-Chiang, Yang, Wen-Luh, Lin, Li-Min, Hsiao, Yu-Ping, Ko, Chum-Min, Chao, Tien-Sheng
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Volume:
9
Year:
2014
Language:
english
Journal:
Nanoscale Research Letters
DOI:
10.1186/1556-276X-9-592
File:
PDF, 1.67 MB
english, 2014
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