Investigations on Bond Strength Development of Plasma...

ECS Transactions 2013 / 03 Vol. 50; Iss. 7

Investigations on Bond Strength Development of Plasma Activated Direct Wafer Bonding with Annealing

Plach, T., Hingerl, K., Stifter, D., Dragoi, V., Wimplinger, M.
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Volume:
50
Language:
english
Journal:
ECS Transactions
DOI:
10.1149/05007.0277ecst
Date:
March, 2013
File:
PDF, 348 KB
english, 2013
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