[ECS 210th ECS Meeting - Cancun, Mexico (October 29-November 3, 2006)] ECS Transactions - Direct Wafer Bonding Enhanced by Ductile Layers Inserted Near the Interface
Olbrechts, Benoit, Lejeune, Bertrand, Bertholet, Yannick, Pardoen, Thomas, Raskin, Jean-PierreVolume:
3
Year:
2006
Language:
english
DOI:
10.1149/1.2357078
File:
PDF, 269 KB
english, 2006