![](/img/cover-not-exists.png)
Estimation of thermal parameters of the enclosed electronic package system by using dynamic thermal response
Jung-Kyun Kim, Wataru Nakayama, Yoshimi Ito, Sang-mo Shin, Sun-Kyu LeeVolume:
19
Year:
2009
Language:
english
Pages:
7
DOI:
10.1016/j.mechatronics.2009.06.013
File:
PDF, 1.16 MB
english, 2009