Estimation of thermal parameters of the enclosed electronic...

Estimation of thermal parameters of the enclosed electronic package system by using dynamic thermal response

Jung-Kyun Kim, Wataru Nakayama, Yoshimi Ito, Sang-mo Shin, Sun-Kyu Lee
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
19
Year:
2009
Language:
english
Pages:
7
DOI:
10.1016/j.mechatronics.2009.06.013
File:
PDF, 1.16 MB
english, 2009
Conversion to is in progress
Conversion to is failed