Numerical analysis of ultrasonic wire bonding: Effects of...

Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy

Yong Ding, Jang-Kyo Kim, Pin Tong
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Volume:
38
Year:
2006
Language:
english
Pages:
14
DOI:
10.1016/j.mechmat.2005.05.007
File:
PDF, 544 KB
english, 2006
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