![](/img/cover-not-exists.png)
Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy
Yong Ding, Jang-Kyo Kim, Pin TongVolume:
38
Year:
2006
Language:
english
Pages:
14
DOI:
10.1016/j.mechmat.2005.05.007
File:
PDF, 544 KB
english, 2006