Selection of a solid layer for high-resolution acoustic imaging of IC packaging defects under dry-contact conditions
Hironori Tohmyoh, Masumi Saka, Tsuyoshi AkaogiVolume:
41
Year:
2009
Language:
english
Pages:
7
DOI:
10.1016/j.mechmat.2009.04.001
File:
PDF, 574 KB
english, 2009