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Self-aligned metal capping layers for copper interconnects using electroless plating
J. Gambino, J. Wynne, J. Gill, S. Mongeon, D. Meatyard, B. Lee, H. Bamnolker, L. Hall, N. Li, M. Hernandez, P. Little, M. Hamed, I. Ivanov, C.L. GanVolume:
83
Year:
2006
Language:
english
Pages:
9
DOI:
10.1016/j.mee.2006.09.008
File:
PDF, 835 KB
english, 2006