ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Investigation on Stress and Voids in Ultra-Thick Metal (UTM) Films with Electrochemical Plating Processes
Nie, Jiaxiang, Yang, Rui-Peng, Kang, Yun, He, Weiye, Liu, Sheng, Kong, Xiang-TaoYear:
2010
Language:
english
DOI:
10.1149/1.3360711
File:
PDF, 481 KB
english, 2010