Crack initiation in Cu-interconnect structures

Microelectronic Engineering 2006 Vol. 83; Iss. 11-12

Crack initiation in Cu-interconnect structures

H. Brillet-Rouxel, E. Arfan, D. Leguillon, M. Dupeux, M. Braccini, S. Orain
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Volume:
83
Year:
2006
Language:
english
Pages:
6
DOI:
10.1016/j.mee.2006.10.053
File:
PDF, 867 KB
english, 2006
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