Seed layer enhancement by electrochemical deposition: The copper seed solution for beyond 45 nm
A. Roule, M. Amuntencei, E. Deronzier, P.H. Haumesser, S. Da Silva, X. Avale, O. Pollet, R. Baskaran, G. PassemardVolume:
84
Year:
2007
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2007.06.014
File:
PDF, 527 KB
english, 2007