A non-fluorine mold release agent for Ni stamp in...

Microelectronic Engineering 2008 Vol. 85; Iss. 7

A non-fluorine mold release agent for Ni stamp in nanoimprint process

Tien-Li Chang, Jung-Chang Wang, Chun-Chi Chen, Ya-Wei Lee, Ta-Hsin Chou
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Volume:
85
Year:
2008
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2008.03.011
File:
PDF, 1.04 MB
english, 2008
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