Improvement of thermal stability of Ni silicide on N+–Si by...

Microelectronic Engineering 2008 Vol. 85; Iss. 10

Improvement of thermal stability of Ni silicide on N+–Si by direct deposition of group III element (Al, B) thin film at Ni/Si interface

Kazuo Tsutsui, Takashi Shiozawa, Koji Nagahiro, Yoshihisa Ohishi, Kuniyuki Kakushima, Parhat Ahmet, Nobuyuki Urushihara, Mineharu Suzuki, Hiroshi Iwai
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
85
Year:
2008
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2008.04.040
File:
PDF, 479 KB
english, 2008
Conversion to is in progress
Conversion to is failed