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High aspect ratio copper through-silicon-vias for 3D integration
Chongshen Song, Zheyao Wang, Qianwen Chen, Jian Cai, Litian LiuVolume:
85
Year:
2008
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2008.05.017
File:
PDF, 1.06 MB
english, 2008