Rigorous diffraction simulations of topographic wafer...

Microelectronic Engineering 2009 Vol. 86; Iss. 4-6

Rigorous diffraction simulations of topographic wafer stacks in double patterning

Feng Shao, Peter Evanschitzky, Tim Fühner, Andreas Erdmann
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Volume:
86
Year:
2009
Language:
english
Pages:
3
DOI:
10.1016/j.mee.2008.11.078
File:
PDF, 320 KB
english, 2009
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