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Reliability of assembly of chips and flex substrates using thermosonic flip-chip bonding process with a non-conductive paste
Cheng-Li Chuang, Wei-How Chen, Hsun-Tien Li, Hui-Ta ChenVolume:
87
Year:
2010
Language:
english
Pages:
12
DOI:
10.1016/j.mee.2010.01.017
File:
PDF, 2.48 MB
english, 2010