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A micromachining technology for integrating low-loss GHz RF passives on non-high-resistivity low-cost silicon MCM substrate
Zhengzheng Wu, Xinxin LiVolume:
87
Year:
2010
Language:
english
Pages:
6
DOI:
10.1016/j.mee.2010.02.011
File:
PDF, 734 KB
english, 2010