Influence of current density on mechanical reliability of...

Microelectronic Engineering 2011 Vol. 88; Iss. 5

Influence of current density on mechanical reliability of Sn–3.5Ag BGA solder joint

Sang-Su Ha, Ji-Yoon Sung, Jeong-Won Yoon, Seung-Boo Jung
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Volume:
88
Year:
2011
Language:
english
Pages:
6
DOI:
10.1016/j.mee.2010.07.007
File:
PDF, 1.95 MB
english, 2011
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