Characterization and modeling of RF substrate coupling...

Microelectronic Engineering 2011 Vol. 88; Iss. 5

Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking

E. Eid, T. Lacrevaz, C. Bermond, S. Capraro, J. Roullard, B. Fléchet, L. Cadix, A. Farcy, P. Ancey, F. Calmon, O. Valorge, P. Leduc
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Volume:
88
Year:
2011
Language:
english
Pages:
5
DOI:
10.1016/j.mee.2010.07.013
File:
PDF, 1.12 MB
english, 2011
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